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INTEGRATED CIRCUITS
DATA SHEET
TJA1054A Fault-tolerant CAN transceiver
Product specification Supersedes data of 2002 Feb 11 2004 Mar 23
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
FEATURES Optimized for in-car low-speed communication * Baud rate up to 125 kBaud * Up to 32 nodes can be connected * Supports unshielded bus wires * Very low ElectroMagnetic Emission (EME) due to built-in slope control function and a very good matching of the CANL and CANH bus outputs * Good ElectroMagnetic Immunity (EMI) in normal operating mode and in low power modes * Fully integrated receiver filters * Transmit Data (TxD) dominant time-out function. Bus failure management * Supports single-wire transmission modes with ground offset voltages up to 1.5 V * Automatic switching to single-wire mode in the event of bus failures, even when the CANH bus wire is short-circuited to VCC * Automatic reset to differential mode if bus failure is removed * Full wake-up capability during failure modes. Protections * Bus pins short-circuit safe to battery and to ground * Thermally protected * Bus lines protected against transients in an automotive environment * An unpowered node does not disturb the bus lines. Support for low power modes * Low current sleep and standby mode with wake-up via the bus lines * Power-on reset flag on the output. ORDERING INFORMATION TYPE NUMBER TJA1054AT TJA1054AU PACKAGE NAME SO14 - DESCRIPTION plastic small outline package; 14 leads; body width 3.9 mm bare die; 1990 x 2730 x 375 m GENERAL DESCRIPTION
TJA1054A
The TJA1054A is the interface between the protocol controller and the physical bus wires in a Controller Area Network (CAN). It is primarily intended for low-speed applications up to 125 kBaud in passenger cars. The device provides differential receive and transmit capability but will switch to single-wire transmitter and/or receiver in error conditions. The TJA1054A is the ESD improved version of the TJA1054. For an overview of the differences between the TJA1054 and the TJA1054A, please refer to "Appendix A". The TJA1054AT is, as the TJA1054T, pin and downwards compatible with the PCA82C252T and the TJA1053T. This means that these two devices can be replaced by the TJA1054AT or the TJA1054T with retention of all functions. The most important improvements of the TJA1054 and the TJA1054A with respect to the PCA82C252 and the TJA1053 are: * Very low EME due to a very good matching of the CANL and CANH output signals * Good EMI, especially in low power modes * Full wake-up capability during bus failures * Extended bus failure management including short-circuit of the CANH bus line to VCC * Support for easy system fault diagnosis * Two-edge sensitive wake-up input signal via pin WAKE.
VERSION SOT108-1 -
2004 Mar 23
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
QUICK REFERENCE DATA SYMBOL VCC VBAT PARAMETER supply voltage on pin VCC battery voltage on pin BAT no time limit operating mode; note 1 load dump IBAT VCANH VCANL VCANH VCANL tPD(L) tr tf Tvj Note battery current on pin BAT CANH bus line voltage CANL bus line voltage CANH bus line transmitter voltage drop CANL bus line transmitter voltage drop propagation delay TXD (LOW) to RXD (LOW) bus line output rise time bus line output fall time virtual junction temperature between 10% and 90%; C1 = 10 nF; see Fig.5 between 10% and 90%; C1 = 1 nF; see Fig.5 sleep mode; VCC = 0 V; VBAT = 12 V VCC = 0 to 5.0 V; VBAT 0 V; no time limit VCC = 0 to 5.0 V; VBAT 0 V; no time limit ICANH = -40 mA ICANL = 40 mA CONDITIONS MIN. 4.75 -0.3 5.0 - - -27 -27 - - - - - -40 - - - - 30 - - - - 1 0.6 0.3 - TYP.
TJA1054A
MAX. 5.25 +40 27 40 50 +40 +40 1.4 1.4 - - - +150 V V V V
UNIT
A V V V V s s s C
1. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V (see Table 2).
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
BLOCK DIAGRAM
TJA1054A
handbook, full pagewidth
BAT 14
VCC 10
INH WAKE STB EN
1 7 5 6 VCC 2 DRIVER TIMER WAKE-UP STANDBY CONTROL TEMPERATURE PROTECTION 9 11 12 8 RTL CANH CANL RTH
TXD
VCC 4 FAILURE DETECTOR PLUS WAKE-UP PLUS TIME-OUT
TJA1054A
ERR
VCC 3 RECEIVER
FILTER
RXD
FILTER
13 GND
MGU383
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
PINNING SYMBOL INH TXD RXD ERR STB EN WAKE RTH RTL VCC CANH CANL GND BAT PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DESCRIPTION
TJA1054A
inhibit output for switching an external voltage regulator if a wake-up signal occurs transmit data input for activating the driver to the bus lines receive data output for reading out the data from the bus lines error, wake-up and power-on indication output; active LOW in normal operating mode when the bus has a failure, and in low power modes (wake-up signal or in power-on standby) standby digital control signal input (active LOW); together with the input signal on pin EN this input determines the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3 enable digital control signal input; together with the input signal on pin STB this input determines the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3 local wake-up signal input (active LOW); both falling and rising edges are detected termination resistor connection; in case of a CANH bus wire error the line is terminated with a predefined impedance termination resistor connection; in case of a CANL bus wire the line is terminated with a predefined impedance supply voltage HIGH-level CAN bus line LOW-level CAN bus line ground battery supply voltage
handbook, halfpage
INH TXD RXD ERR STB EN WAKE
1 2 3 4 5 6 7
MGU379
14 BAT 13 GND 12 CANL
TJA1054AT 11 CANH
10 VCC 9 8 RTL RTH
Fig.2 Pin configuration.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
FUNCTIONAL DESCRIPTION The TJA1054A is the interface between the CAN protocol controller and the physical wires of the CAN bus (see Fig.7). It is primarily intended for low-speed applications, up to 125 kBaud, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. To reduce EME, the rise and fall slopes are limited. This allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. Moreover, the device supports transmission capability on either bus line if one of the wires is corrupted. The failure detection logic automatically selects a suitable transmission mode. In normal operating mode (no wiring failures) the differential receiver is output on pin RXD (see Fig.1). The differential receiver inputs are connected to pins CANH and CANL through integrated filters. The filtered input signals are also used for the single-wire receivers. The receivers connected to pins CANH and CANL have threshold voltages that ensure a maximum noise margin in single-wire mode. A timer function (TxD dominant time-out function) has been integrated to prevent the bus lines from being driven into a permanent dominant state (thus blocking the entire network communication) due to a situation in which pin TXD is permanently forced to a LOW level, caused by a hardware and/or software application failure.
TJA1054A
If the duration of the LOW level on pin TXD exceeds a certain time, the transmitter will be disabled. The timer will be reset by a HIGH level on pin TXD. Failure detector The failure detector is fully active in the normal operating mode. After the detection of a single bus failure the detector switches to the appropriate mode (see Table 1). The differential receiver threshold voltage is set at -3.2 V typical (VCC = 5 V). This ensures correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures 1, 2, 5 and 6a. These failures, or recovery from them, do not destroy ongoing transmissions. The output drivers remain active, the termination does not change and the receiver remains in differential mode (see Table 1). Failures 3, 3a and 6 are detected by comparators connected to the CANH and CANL bus lines. Failures 3 and 3a are detected in a two-step approach. If the CANH bus line exceeds a certain voltage level, the differential comparator signals a continuous dominant condition. Because of inter operability reasons with the predecessor products PCA82C252 and TJA1053, after a first time-out the transceiver switches to single-wire operation through CANH. If the CANH bus line is still exceeding the CANH detection voltage for a second time-out, the TJA1054A switches to CANL operation; the CANH driver is switched off and the RTH bias changes to the pull-down current source. The time-outs (delays) are needed to avoid false triggering by external RF fields.
Table 1
Bus failures DESCRIPTION CANH wire interrupted CANL wire interrupted CANH short-circuited to battery CANH short-circuited to VCC CANL short-circuited to ground CANH short-circuited to ground CANL short-circuited to battery CANL short-circuited to VCC CANL and CANH mutually short-circuited TERMINATION TERMINATION CANH CANL CANH (RTH) CANL (RTL) DRIVER DRIVER on on weak; note 1 weak; note 1 on on on on on on on on on weak; note 2 on weak; note 2 on weak; note 2 on on off off on on on on on on on on on off on off on off RECEIVER MODE differential differential CANL CANL CANH differential CANH differential CANH
FAILURE 1 2 3 3a 4 5 6 6a 7 Notes
1. A weak termination implies a pull-down current source behaviour of 75 A typical. 2. A weak termination implies a pull-up current source behaviour of 75 A typical. 2004 Mar 23 6
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain period of time. This delay is needed to avoid false triggering by external RF fields. After detection of failure 6, the reception is switched to the single-wire mode through CANH; the CANL driver is switched off and the RTL bias changes to the pull-up current source. Recovery from failures 3, 3a and 6 is detected automatically after reading a consecutive recessive level by corresponding comparators for a certain period of time. Failures 4 and 7 initially result in a permanent dominant level on pin RXD. After a time-out the CANL driver is switched off and the RTL bias changes to the pull-up current source. Reception continues by switching to the single-wire mode via pins CANH or CANL. When failures 4 or 7 are removed, the recessive bus levels are restored. If the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode. If any of the wiring failure occurs, the output signal on pin ERR will be set to LOW. On error recovery, the output signal on pin ERR will be set to HIGH again. In case of an interrupted open bus wire, this failure will be detected and signalled only if there is an open wire between the transmitting and receiving node(s). Thus, during open wire failures, pin ERR typically toggles. Table 2 Normal operating and low power modes PIN STB LOW LOW LOW HIGH PIN ERR PIN EN HIGH LOW wake-up interrupt signal; notes 1 2 and 3 HIGH LOW wake-up interrupt signal; notes 1 2 and 3 wake-up interrupt signal; notes 1 2 and 3 dominant recessive received data received data PIN RXD HIGH
TJA1054A
During all single-wire transmissions, EMC performance (both immunity and emission) is worse than in the differential mode. The integrated receiver filters suppress any HF noise induced into the bus wires. The cut-off frequency of these filters is a compromise between propagation delay and HF suppression. In single-wire mode, LF noise cannot be distinguished from the required signal. Low power modes The transceiver provides three low power modes which can be entered and exited via STB and EN (see Table 2 and Fig.3). The sleep mode is the mode with the lowest power consumption. Pin INH is switched to HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL. If the supply voltage is provided, pins RXD and ERR will signal the wake-up interrupt. The standby mode operates in the same way as the sleep mode but with a HIGH level on pin INH. The power-on standby mode is the same as the standby mode, however, in this mode the battery power-on flag is shown on pin ERR instead of the wake-up interrupt signal. The output on pin RXD will show the wake-up interrupt. This mode is only for reading out the power-on flag.
MODE Goto-sleep command Sleep Standby Power-on standby Normal operating Notes
PIN RTL SWITCHED TO VBAT
HIGH
LOW(4) LOW LOW VBAT power-on flag; notes 1 and 5 HIGH error flag
VBAT
no error flag
VCC
1. If the supply voltage VCC is present. 2. Wake-up interrupts are released when entering normal operating mode.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V. 4. In case the goto-sleep command was used before. When VCC drops, pin EN will become LOW, but due to the fail-safe functionality this does not effect the internal functions. 5. VBAT power-on flag will be reset when entering normal operating mode. Wake-up requests are recognized by the transceiver through two possible channels: * The bus lines for remote wake-up * Pin WAKE for local wake-up. In order to wake-up the transceiver remotely through the bus lines, a filter mechanism is integrated. This mechanism makes sure that noise and any present bus failure conditions do not result into an erroneous wake-up. Because of this mechanism it is not sufficient to simply pull the CANH or CANL bus lines to a dominant level for a certain time. To guarantee a successful remote wake-up under all conditions, a message frame with a dominant phase of at least the maximum specified tCANH or tCANL in it is required. A local wake-up through pin WAKE is detected by a rising or falling edge with a consecutive level with the maximum specified tWAKE. On a wake-up request the transceiver will set the output on pin INH to HIGH which can be used to activate the external supply voltage regulator. If VCC is provided the wake-up request can be read on the ERR or RXD outputs, so the external microcontroller can activate the transceiver (switch to normal operating mode) via pins STB and EN. To prevent a false remote wake-up due to transients or RF fields, the wake-up voltage levels have to be maintained for a certain period of time. In the low power modes the failure detection circuit remains partly active to prevent an increased power consumption in the event of failures 3, 3a, 4 and 7. To prevent a false local wake-up during an open wire at pin WAKE, this pin has a weak pull-up current source towards VBAT. However, in order to prevent EMC issues, it is recommended to connect a not used pin WAKE to pin BAT. Pin INH is set to floating only if the goto-sleep command is entered successfully. To enter a successful goto-sleep command under all conditions, this command must be kept stable for the maximum specified th(sleep). Pin INH will be set to a HIGH level again by the following events only: * VBAT power-on (cold start) * Rising or falling edge on pin WAKE * A message frame with a dominant phase of at least the maximum specified tCANH or tCANL, while pin EN or pin STB is at a LOW level * Pin STB goes to a HIGH level with VCC active. To provide fail-safe functionality, the signals on pins STB and EN will internally be set to LOW when VCC is below a certain threshold voltage (VCC(stb)). Power-on After power-on (VBAT switched on) the signal on pin INH will become HIGH and an internal power-on flag will be set. This flag can be read in the power-on standby mode through pin ERR (STB = 1; EN = 0) and will be reset by entering the normal operating mode. Protections A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage. If the junction temperature exceeds the typical value of 165 C, the transmitter output stages are disabled. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the device will continue to operate. The pins CANH and CANL are protected against electrical transients which may occur in an automotive environment.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
handbook, full pagewidth
POWER-ON STANDBY 10
NORMAL (4) 11
GOTO SLEEP (5) 01
(1) (2) (3)
STANDBY 00
MBK949
SLEEP 00
Mode 10 stands for: Pin STB = HIGH and pin EN = LOW. (1) Mode change via input pins STB and EN. (2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is inactive and possibly there is no VCC. Mode control is only possible if VCC of the transceiver is active. (3) Pin INH is activated after wake-up via bus or input pin WAKE. (4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared. (5) Transitions to sleep mode: pin INH is deactivated.
Fig.3 Mode control.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. SYMBOL VCC VBAT Vn VCANH VCANL Vtrt(n) VWAKE IWAKE VINH VRTH VRTL RRTH RRTL Tvj Tstg Vesd PARAMETER supply voltage on pin VCC battery voltage on pin BAT DC voltage on pins TXD, RXD, ERR, STB and EN CANH bus line voltage CANL bus line voltage transient voltage on pins CANH and CANL DC input voltage on pin WAKE DC input current on pin WAKE DC output voltage on pin INH DC voltage on pin RTH DC voltage on pin RTL termination resistance on pin RTH termination resistance on pin RTL virtual junction temperature storage temperature electrostatic discharge voltage human body model; note 4 pins RTH, RTL, CANH and CANL all other pins machine model; note 5 any pin Notes 1. All voltages are defined with respect to pin GND. Positive current flows into the device. 2. Only relevant if VWAKE < VGND - 0.3 V; current will flow into pin GND. -300 -4 -2 +4 +2 note 3 note 2 see Fig.6 CONDITIONS MIN. -0.3 -0.3 -0.3 -27 -27 -150 - -15 -0.3 -0.3 -0.3 500 500 -40 -55 +6
TJA1054A
MAX. +40 VCC + 0.3 +40 +40 +100 VBAT + 0.3 - VBAT + 0.3 VBAT + 1.2 VBAT + 1.2 16000 16000 +150 +150
UNIT V V V V V V V mA V V V C C kV kV V
+300
3. Junction temperature in accordance with "IEC 60747-1". An alternative definition is: Tvj = Tamb + P x Rth(vj-a) where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and operating ambient temperature (Tamb). 4. Equivalent to discharging a 100 pF capacitor through a 1.5 k resistor. 5. Equivalent to discharging a 200 pF capacitor through a 10 resistor and a 0.75 H coil. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-s) PARAMETER thermal resistance from junction to ambient thermal resistance from junction to substrate bare die CONDITIONS in free air in free air VALUE 120 40 UNIT K/W K/W
QUALITY SPECIFICATION Quality specification in accordance with "AEC-Q100".
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
DC CHARACTERISTICS VCC = 4.75 to 5.25 V; VBAT = 5.0 to 27 V; VSTB = VCC; Tvj = -40 to +150 C; all voltages are defined with respect to ground; positive currents flow into the device; unless otherwise specified; notes 1 2 and 3 SYMBOL PARAMETER CONDITIONS MIN. - - 7 17 TYP. MAX. UNIT
Supplies (pins VCC and BAT) VCC VCC(stb) ICC supply voltage on pin VCC supply voltage for forced standby mode (fail-safe) supply current normal operating mode; VTXD = VCC (recessive) normal operating mode; VTXD = 0 V (dominant); no load low power modes; VTXD = VCC VBAT battery voltage on pin BAT no time limit operating mode load dump IBAT battery current on pin BAT all modes and in low power modes at VRTL = VWAKE = VINH = VBAT VBAT = 12 V VBAT = 5.0 to 27 V VBAT = 3.5 V VBAT = 1 V VBAT(Pwon) power-on flag voltage on pin BAT low power modes power-on flag set power-on flag not set Itot supply current plus battery current low power modes; VCC = 5 V; VBAT = VWAKE = VINH = 12 V - 3.5 - - - 30 1 - 60 V V A 10 5 5 0 30 30 20 0 50 125 30 10 A A A A 4.75 2.75 4 10 5.25 4.5 11 27 V V mA mA
0 -0.3 5.0 -
0 - - -
10 +40 27 40
A V V V
Pins STB, EN and TXD VIH VIL IIH HIGH-level input voltage LOW-level input voltage HIGH-level input current pins STB and EN pin TXD IIL LOW-level input current pins STB and EN pin TXD VI = 1 V 4 -800 8 -320 - -100 A A VI = 4 V - -200 9 -80 20 -25 A A 0.7VCC -0.3 - - VCC + 0.3 V 0.3VCC V
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
SYMBOL Pins RXD and ERR VOH
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
HIGH-level output voltage on pin ERR on pin RXD lO = -100 A IO = -1 mA IO = 1.6 mA IO = 7.5 mA VWAKE = 0 V; VBAT = 27 V VSTB = 0 V IINH = -0.18 mA sleep mode; VINH = 0 V no failures and bus failures 1, 2, 5 and 6a; see Fig.4 VCC = 5 V VCC = 4.75 to 5.25 V -3.5 -3.2 -2.9 V -0.70VCC -0.64VCC -0.58VCC V - - 0.2 - - 1.4 -45 - 100 - 1.85 2.5 V V V V mA A mA A V V VCC - 0.9 - VCC - 0.9 - 0 0 -10 2.5 - - - - -4 3.2 - - VCC VCC 0.4 1.5 -1 3.9 V V V V A V
VOL Pin WAKE IIL Vth(wake) Pin INH VH IL Vth(dif)
LOW-level output voltage on pins ERR and RXD
LOW-level input current wake-up threshold voltage
HIGH-level voltage drop leakage current
0.8 5
V A
Pins CANH and CANL differential receiver threshold voltage
VO(reces)
recessive output voltage on pin CANH on pin CANL
VTXD = VCC RRTH < 4 k RRTL < 4 k VTXD = 0 V; VEN = VCC ICANH = -40 mA ICANL = 40 mA normal operating mode; VCANH = 0 V; VTXD = 0 V low power modes; VCANH = 0 V; VCC = 5 V VCC - 1.4 - - -110 - 45 - 1.5 1.1 - -80 -0.25 70 0 1.7 1.8 VCC - 0.2 -
VO(dom)
dominant output voltage on pin CANH on pin CANL
IO(CANH)
output current on pin CANH
IO(CANL)
output current on pin CANL
normal operating mode; VCANL = 14 V; VTXD = 0 V low power modes; VCANL = 12 V; VBAT = 12 V
Vd(CANH)(sc)
detection voltage for short-circuit to battery voltage on pin CANH detection voltage for short-circuit to battery voltage on pin CANL wake-up threshold voltage on pin CANL on pin CANH
normal operating mode low power modes normal operating mode VCC = 5 V VCC = 4.75 to 5.25 V low power modes low power modes
Vd(CANL)(sc)
6.6 1.32VCC 2.5 1.1
7.2 1.44VCC 3.2 1.8
7.8 1.56VCC 3.9 2.5
V V V V
Vth(wake)
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
SYMBOL Vth(wake)
PARAMETER difference of wake-up threshold voltages
CONDITIONS low power modes normal operating mode and failures 4, 6 and 7 VCC = 5 V VCC = 4.75 to 5.25 V
MIN. 0.8
TYP. 1.4 -
MAX.
UNIT V
Vth(CANH)(se) single-ended receiver threshold voltage on pin CANH
1.5 0.30VCC
1.7 0.34VCC
1.85 0.37VCC
V V
normal operating mode and Vth(CANL)(se) single-ended receiver threshold voltage on pin CANL failures 3 and 3a VCC = 5 V VCC = 4.75 to 5.25 V Ri(CANH)(se) Ri(CANL)(se) Ri(dif) Rsw(RTL) Rsw(RTH) VO(RTH) IO(RTL) Ipu(RTL) Ipd(RTH) single-ended input resistance on pin CANH single-ended input resistance on pin CANL differential input resistance normal operating mode normal operating mode normal operating mode 3.15 0.63VCC 110 110 220 - - 3.3 0.66VCC 165 165 330 3.45 0.69VCC 270 270 540 V V k k k V mA A A
Pins RTH and RTL switch-on resistance between pin RTL and VCC switch-on resistance between pin RTH and ground output voltage on pin RTH output current on pin RTL pull-up current on pin RTL pull-down current on pin RTH normal operating mode; IO < 10 mA normal operating mode; IO < 10 mA low power modes; VRTL = 0 V normal operating mode and failures 4, 6 and 7 normal operating mode and failures 3 and 3a 50 50 0.7 -0.65 75 75 100 100 1.0 -0.3 - -
low power modes; IO = 1 mA - -1.25 - -
Thermal shutdown Tj(sd) Notes 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at Tamb = 125 C for dies on wafer level, and above this for cased products 100% tested at Tamb = 25 C, unless otherwise specified. 2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground. 3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V (see Table 2). junction temperature for shutdown 155 165 180 C
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
TIMING CHARACTERISTICS VCC = 4.75 to 5.25 V; VBAT = 5.0 to 27 V; VSTB = VCC; Tvj = -40 to +150 C; all voltages are defined with respect to ground; unless otherwise specified; notes 1 2 and 3 SYMBOL tt(r-d) PARAMETER CONDITIONS MIN. 0.35 TYP. 0.60 MAX. - UNIT s
CANL and CANH output transition between 10% and 90%; time for recessive to dominant R1 = 100 ; C1 = 10 nF; C2 = not present; see Fig.5 CANL and CANH output transition between 10% and 90%; time for dominant to recessive R1 = 100 ; C1 = 1 nF; C2 = not present; see Fig.5 propagation delay TXD (LOW) to RXD (LOW) no failures and failures 1, 2, 5 and 6a; R1 = 100 ; see Figs 4 and 5 C1 = 1 nF; C2 = not present C1 = C2 = 3.3 nF failures 3, 3a, 4, 6 and 7; R1 = 100 ; see Figs 4 and 5 C1 = 1 nF; C2 = not present C1 = C2 = 3.3 nF
tt(d-r)
0.2
0.3
-
s
tPD(L)
- -
0.75 1
1.5 1.75
s s
- -
0.85 1.1
1.4 1.7
s s
tPD(H)
propagation delay TXD (HIGH) to RXD (HIGH)
no failures and failures 1, 2, 5 and 6a; R1 = 100 ; see Figs 4 and 5 C1 = 1 nF; C2 = not present C1 = C2 = 3.3 nF failures 3, 3a, 4, 6 and 7; R1 = 100 ; see Figs 4 and 5 C1 = 1 nF; C2 = not present C1 = C2 = 3.3 nF - - 5 0.75 7 7 7 1.1 1.5 - - - - - 1.7 2.2 50 4 38 38 38 s s s ms s s s - - 1.2 2.5 1.9 3.3 s s
treact(sleep) tdis(TxD) tCANH tCANL tWAKE
reaction time of goto-sleep command disable time of TxD permanent dominant timer
note 4 normal operating mode; VTXD = 0 V
dominant time for remote wake-up low power modes; VBAT = 12 V; on pin CANH note 4 dominant time for remote wake-up low power modes; VBAT = 12 V; on pin CANL note 4 required time on pin WAKE for local wake-up failure detection time low power modes; VBAT = 12 V; for wake-up after receiving a falling or rising edge; note 4 normal operating mode failures 3 and 3a failures 4, 6 and 7 low power modes; VBAT = 12 V failures 3 and 3a failures 4 and 7
tdet
1.6 0.3 1.6 0.1
- - - -
8.0 1.6 8.0 1.6
ms ms ms ms
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
SYMBOL trec
PARAMETER failure recovery time
CONDITIONS normal operating mode failures 3 and 3a failures 4 and 7 failure 6 low power modes; VBAT = 12 V failures 3, 3a, 4 and 7
MIN. 0.3 7 125 0.3 -
TYP. - - - - 4
MAX. 1.6 38 750 1.6 -
UNIT ms s s ms
Ndet
pulse-count difference between CANH and CANL for failure detection number of consecutive pulses on CANH and CANL simultaneously for failure recovery
normal operating mode and failures 1, 2, 5 and 6a; pin ERR becomes LOW failures 1, 2, 5 and 6a
Nrec
-
4
-
Notes 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at Tamb = 125 C for dies on wafer level, and above this for cased products 100% tested at Tamb = 25 C, unless otherwise specified. 2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground. 3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V (see Table 2). 4. To guarantee a successful mode transition under all conditions, the maximum specified time must be applied.
handbook, full pagewidth
VTXD
VCC 0V
VCANL
5V 3.6 V 1.4 V
VCANH
0V
2.2 V
-3.2 V Vdiff VRXD 0.7VCC 0.3VCC tPD(L) Vdiff = VCANH - VCANL. tPD(H)
MGL424
-5 V
Fig.4 Timing diagram for dynamic characteristics.
2004 Mar 23
15
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TEST AND APPLICATION INFORMATION
TJA1054A
handbook, full pagewidth
+5 V INH WAKE TXD STB EN RXD 1 7 2 5 6 3 13 20 pF GND 4 ERR
MGU381
BAT 14
VCC 10 8 RTH R1 C1
12
CANL C2
TJA1054A
11 CANH
9
RTL R1 C1
Termination resistors R1 (100 ) are not connected to pin RTH or pin RTL for testing purposes because the minimum load allowed on the CAN bus lines is 500 per transceiver. The capacitive bus load of 10 nF is split into 3 equal capacitors (3.3 nF) to simulate the bus cable.
Fig.5 Test circuit for dynamic characteristics.
handbook, full pagewidth
+12 V
+5 V
10 F VCC 10 8 RTH 125 511 12 CANL 1 nF 11 CANH 511 9 13 20 pF GND 4 ERR
MGU382
INH WAKE TXD STB EN RXD 1 7 2 5 6 3 14
BAT
1 nF
TJA1054A
GENERATOR
1 nF
RTL 125 1 nF
The waveforms of the applied transients on pins CANH and CANL will be in accordance with "ISO 7637 part 1": test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
2004 Mar 23
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
handbook, full pagewidth
VBAT
BATTERY
P8xC592/P8xCE598
CAN CONTROLLER
VDD
+5 V +5 V
CTX0
CRXO
Px.x
Px.x
Px.x
TXD WAKE 2 7 3
RXD 5
STB 4
ERR 6
EN 1
INH 14 BAT VCC GND 100 nF
TJA1054A
CAN TRANSCEIVER
10 13
8 RTH
11 CANH
12 CANL
9 RTL
CAN BUS LINE
MGU380
For more information: please refer to the separate FTCAN information available from our web site.
Fig.7 Application diagram.
2004 Mar 23
17
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
BONDING PAD LOCATIONS COORDINATES(1) SYMBOL INH TXD RXD ERR STB EN WAKE RTH RTL VCC CANH CANL GND GND BAT Note PAD x 1 2 3 4 5 6 7 8 9 10 11 12 13a 13b 14 106 111 750 1347 2248 2551 2559 2463 2389 1886 900 401 80 80 105
TJA1054A
y 317 168 111 111 103 240 381 1443 1840 1809 1698 1698 1356 1241 772
1. All coordinates (m) represent the position of the centre of each pad with respect to the bottom left-hand corner of the top aluminium layer (see Fig.8).
handbook, full pagewidth
10 12 11
9
8 13a 13b 1990 m 14
TJA1054AU
7 1 2 6 3 4 5
x
0
0 y 2730 m
MGU384
Fig.8 Bonding pad locations.
2004 Mar 23
18
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
APPENDIX A Overview of differences between the TJA1054 and the TJA1054A Limiting values TJA1054 SYMBOL VCANH VCANL Vesd PARAMETER CANH bus line voltage CANL bus line voltage electrostatic discharge voltage human body model pins RTH, RTL, CANH, and CANL all other pins machine model any pin Bare die PARAMETER Dimensions Bonding pad coordinates Note 1. The bonding pad coordinates partly differ between the TJA1054 and the TJA1054A. TJA1054 1990 x 2700 note 1 -175 +175 -300 -2 -2 +2 +2 -4 -2 CONDITIONS MIN. -40 -40 MAX. +40 +40 MIN. -27 -27
TJA1054A
TJA1054A UNIT MAX. +40 +40 +4 +2 +300 V V kV kV V
TJA1054A 1990 x 2730 note 1
UNIT m
2004 Mar 23
19
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
PACKAGE OUTLINE
SO14: plastic small outline package; 14 leads; body width 3.9 mm
TJA1054A
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 inches 0.069 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
0.028 0.004 0.012
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2004 Mar 23
20
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON-T and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. 2004 Mar 23 21
TJA1054A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L(8), PMFP(9), WQCCN..L(8) Notes not suitable not suitable(4) suitable not not recommended(5)(6) recommended(7)
TJA1054A
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable
not suitable
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages.
2004 Mar 23
22
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
REVISION HISTORY REV 3 DATE 20040323 CPCN 200310013C Modification: DESCRIPTION Product specification (9397 750 11722)
TJA1054A
* Add VBAT = 5.3 V to 27 V condition for correct signalling of local or remote wake-up event at transceiver pins RXD and ERR. * Mode control diagram, Fig.3, completed. * Recommendation added, to connect a not used pin WAKE to pin BAT. * Reference of bond pad coordinates changed from the bottom left-hand corner of the die, to the bottom left-hand corner of the top aluminium layer. * Change of bare die dimension. * Add Chapter REVISION HISTORY. 2 20011120 - Product specification (9397 750 08321)
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data
Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
2004 Mar 23
23
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS
TJA1054A
Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
2004 Mar 23
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R16/03/pp25
Date of release: 2004
Mar 23
Document order number:
9397 750 11722

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